| Action Agenda |
| # | Time | Submitter | Type | Presenter | Agenda Item | Supporting Documents |
1 | 10:00 | EPS VP TECH | Discussion | McCann | Technology Working Group Status | - Technology Functional Team
110305 | 2 | 10:15 | _ | Discussion | Ramm | 3D/TSV Technical Committee | | 3 | 10:30 | EPS VP TECH | Discussion | McCann | Items for EPS Board of Governors Meeting:
Connect Thermal and EDMS Technical Committees for collaboration
Make it a requirement that each TC participate in the HIR
3D Technical Committee should use the same nomenclature from HIR chapter 22 within the TC - 2D enhanced and 3D architecture.
| | 4 | 10:50 | EPS ED | Discussion | Manning | Action Items | - Action Items
110308 | 5 | 10:55 | EPS ED | Discussion | Manning | Next Technology FT Call: August 21 | |